Composite Nanoparticles for Defectivity Reduction during CMP
نویسندگان
چکیده
The synthesis and characterization of nanoparticles comprising a polymer core and a silica shell, with and without a silane-coupling agent between the core and the shell, is presented in this paper. The first step in the nanoparticle synthesis is a “surfactant free” radical suspension polymerization in water of monomeric units of methylmethacrylate in the presence of methoxypolyethilene glycol methacrylate, as a comonomer, and 4-vynilpyridine. Vynilpyridine provides electrostatic stabilization in the form of functional basic amino groups located at the polymer surface, as confirmed by FTIR analysis. In the second step of the procedure, the Polymethyl Methacrylate (PMMA) spheres were mixed with silica spheres. Dynamic Light Scattering (DLS) measurements were used to correlate particle size to pH or ionic strength, while Electrophoretic Light Scattering (ELS) measurements revealed the dependency of the zeta potential on pH or ionic strength (I). Since the interaction between the abrasives and the wafer surface in the CMP process is expected to be dependent also on the particle morphology and structure of the polymer core, N2 adsorption isotherms on PMMA were taken to evaluate porosity and total surface area using the Brunauer-Emmett-Teller (BET) method.
منابع مشابه
Understanding & Controlling LPCs in CMP
The overall trend is that more and more device layers in the fab as well as more and more wafer-level packaging flows require CMP steps for overall process integration. From high-k metal-gate (HKMG) CMOS transistors for 45nm and beyond, to through-silicon vias (TSV) for heterogeneous 3D integration, cleverly engineered substrates such as stressed-silicon-on-insulator (sSOI) and silicon-on-diamo...
متن کاملPolystyrene core–silica shell composite particles: effect of mesoporous shell structures on oxide CMP and mechanical stability
Organic/inorganic composite particles with a core–shell structure exhibit potential applications in chemical mechanical polishing/planarization (CMP) for mechanically challenging materials (copper and low-k dielectrics etc.). In this work, the spherical composites comprised of polystyrene (PS) cores and mesoporous silica (mSiO2) shells were synthesized through a self-assembly of cetyltrimethyla...
متن کاملProper Filtration Removes Oversized Particles from CMP Slurry Systems
Single stage recirculation filtrations were performed to remove oversized particles from colloidal silica based Chemical Mechanical Polishing (CMP) slurry. Proper filtration was demonstrated to achieve rapid removal of oversized particles while not altering the percent solids of the CMP slurry. Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems....
متن کاملOxygen reduction reaction on Pt/C at the presence of super paramagnetic of Fe3O4 nanoparticles for PEMFCs
In this paper the role of super paramagnetic iron oxide nanoparticles (SPI) on Platinum nanoclusters on activated carbon (Pt/C) for electrocatalytic oxygen reduction reaction was considered. Four composites of Pt/C and super paramagnetic iron oxide nanoparticles were prepared with the same total composites weight and different loading of Pt/C (1.2, 0.6, 0.4 and 0.3 mg ). The composite attached ...
متن کاملA flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials
A new idea of polishing pad called flexible nanobrush pad (FNP) has been proposed for the low down pressure chemical mechanical planarization (CMP) process of Cu/ultra-low-к materials. The FNP was designed with a surface layer of flexible brush-like nanofibers which can 'actively' carry nanoscale abrasives in slurry independent of the down pressure. Better planarization performances including h...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2004